System |
CPU |
8-core NVIDIA Carmel ARM® v8.2 64-bit CPU |
GPU |
NVIDIA Volta architecture with 512 NVIDIA® CUDA® cores and 64 Tensor cores |
DL Accelerator |
2x NVDLA Engines |
Memory |
1 LPDDR4x DRAM, up to 32GB |
Software Support |
- Linux
- NVIDIA JetPack SDK
|
I/O Interface |
USB |
4 USB 3.0 Type A |
Serial |
2 COM RS-232/422/485 |
CAN Bus |
2 CAN Bus support CAN FD (Optional Isolation) |
Micro USB |
- 1 Micro USB console debug port
- 1 Micro USB OS flash port
|
Button |
- 1 Power Button
- 1 Force Recovery Button
- 1 Reset Button
|
LED |
Power, HDD, 2 User Programming |
SIM |
2 SIM Card Socket |
Antenna |
6 Antenna for WiFi/4G/5G/LTE/GPRS/UMTS |
Expansion |
M.2 |
- 1 M.2 Key B Socket (3042/3052, PCIe/USB3)
- 1 M.2 Key E Socket (2230, PCIe/USB)
|
Graphics |
Interface |
2 Digital Display, up to 4Kx2K @30Hz |
Video Encode |
- HEVC: Up to 4x4K @60, 8x4K @30, 16x1080p @60, 32x1080p @30
- H.264: Up to 4x4K @60, 8x4K @30, 14x1080p @60, 30x1080p @30
|
Video Decode |
- HEVC: 2x8K @30, 6x4K @60, 12x4K@30, 26x1080p @60, 52x1080p @30
- H.264: 4x4K @60, 8x4K @30, 16x1080p @60, 32x1080p @30
|
Camera |
GMSL |
8 Fakra-Z connectors for GMSL 1/GMSL 2 automotive cameras |
Storage |
M.2 |
1 M.2 Key M Socket (2280, PCIe x2) |
eMMC |
1 eMMC 5.1, 32GB |
SD |
1 Micro SD (External) |
Ethernet |
LAN 1 |
10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector |
PoE |
LAN 2 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector |
LAN 3 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector |
LAN 4 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector |
LAN 5 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector |
Power |
Power Input |
DC 9V to 50V |
Power Interface |
3-pin Terminal Block : V+, V-, Frame Ground |
Ignition Control |
16-mode Software Ignition Control |
Remote Switch |
3-pin Remote Switch Terminal Block |
Mechanical |
Dimensions (W x L x H) |
212.6mm x 149.0mm x 60.4mm (8.37" x 5.87" x 2.38") |
Weight |
2.4 kg (5.29lb) |
Mounting |
- Wallmount by mounting bracket
- DIN Rail Mount (Optional)
|
Environment |
Operating Temperature |
30W TDP Mode : -20°C to 70°C (-4°F to 158°F), Fanless
MAX TDP Mode : -20°C to 70°C (-4°F to 158°F), with Fan Sink
|
Storage Temperature |
-40°C to 85°C (-40°F to 185°F) |
Humidity |
5% to 95% Humidity, non-condensing |
Relative Humidity |
95% @ 70°C |
Shock |
Operating, MIL-STD-810G, Method 516.7, Procedure I |
Vibration |
Operating, MIL-STD-810G, Method 514.6, Procedure I, Category 4 |
EMC |
CE, FCC, EN50155, EN50121-3-2 |