|
Date |
Nov. 20 – 22, 2024 |
Venue |
PACIFICO YOKOHAMA, Japan
|
Booth No. |
Exhibition Hall / Annex Hall
#AF-04 |
Pre-Registration |
Register now |
Vecow will be showcasing our solutions at Intel's booth during Edge Tech+ 2024.
Our demonstrations will highlight a comprehensive range of innovative products designed for compact form factor Edge AI applications:
1. Visual SLAM Solutions
- Mobile Mapping Kit: Using Vecow slim and compact computer
ECS-4700, we have collaborated with Kudan to propose a mapping solution that meets the industry's demand for accurate and comprehensive 3D environmental information.
- Mobile Robot Development Kit: Leveraging Vecow Jetson platform
EAC-5000 in collaboration with Kudan, we are introducing a package for autonomous mobile robot (AMR) development, enabling a significant reduction in maintenance efforts.
2. Edge AI Solutions
- Intel® Core™ Ultra Processor Stackable AI PC
TGS-1500
- Intel® Core™ Ultra Processor Ultra-compact Fanless AI PC
SPC-9100
- High-performance Storage Server System
ICS-1110S
✓ Schedule a meeting at
[email protected] and be sure to visit us. We are looking forward to the opportunity to meet you soon.