Exhibition

EdgeTech+ 2024, Yokohama

Date Nov. 20 – 22, 2024
Venue
PACIFICO YOKOHAMA, Japan
Booth No. Exhibition Hall / Annex Hall
#AF-04
Pre-Registration Register now
 
Vecow will be showcasing our solutions at Intel's booth during Edge Tech+ 2024.
 
Our demonstrations will highlight a comprehensive range of innovative products designed for compact form factor Edge AI applications:
 
1. Visual SLAM Solutions
    - Mobile Mapping Kit: Using Vecow slim and compact computer ECS-4700, we have collaborated with Kudan to propose a mapping solution that meets the industry's demand for accurate and comprehensive 3D environmental information.
   - Mobile Robot Development Kit: Leveraging Vecow Jetson platform EAC-5000 in collaboration with Kudan, we are introducing a package for autonomous mobile robot (AMR) development, enabling a significant reduction in maintenance efforts.
 
2. Edge AI Solutions
  - Intel® Core™ Ultra Processor Stackable AI PC TGS-1500
  - Intel® Core™ Ultra Processor Ultra-compact Fanless AI PC SPC-9100
  - EN60945 Marine-grade Rugged Compact System ECS-4700-PoER
  - Fanless AI Computing System EVS-3400
  - High-performance Storage Server System ICS-1110S
 
✓ Schedule a meeting at [email protected] and be sure to visit us. We are looking forward to the opportunity to meet you soon.
 

 

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